RANDOM SOLDER WIRE 63/37 0.8MM 100G (RANDOM)

Composition: The wire is composed of 63% tin (Sn) and 37% lead (Pb), an eutectic alloy that melts at a single, low temperature of around 183°C (361°F). Diameter: The 0.8mm diameter makes it suitable for detailed work on printed circuit boards (PCBs), small components, and general wiring tasks, offering excellent control. Core: It features a rosin flux core (typically 1.8% to 2.0% flux content) which cleans metal surfaces during soldering, prevents oxidation, and ensures a strong, reliable joint without needing separate flux. Weight: Each spool contains 100 grams of solder wire, providing a generous amount for multiple projects. Performance: Users and experts note its good solderability, insulation resistance, and non-corrosive properties, resulting in smooth, efficient soldering with less spattering.